26th Congress of International Council of the Aeronautical Sciences
including the 8th AIAA Aviation Technology, Integration, and Operations (ATIO) Conference
14 - 19 September 2008, Anchorage, Alaska, USA
Paper ICAS 2008-6.1.1

RELIABILITY STUDY OF POWER MODULE BY STOCHASTIC UNCERTAINTY METHOD FOR AN AERONAUTICAL APPLICATION

A. Micol, T. Lhommeau*, R. Meuret**, C. Martin, M. Mermet-Guyennet*, M. Karama
ENIT-LGP, France; *PEARL, Alstom Transport Tarbes, France; **Hispano-Suiza, France

Keywords: Reliability, IGBT module, Thermal cycling, Solder ageing

This work studies the reliability of power electronic component in aeronautical environment. The methodologies used are based on the mechanical stochastic uncertainty method to take into account the random parameters due to the process. This method could be useful to give the geometries indication to reach the reliability necessary.

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